2UUL BG03 0.12mm CPU BGA Reballing Stencil for iPhone 17 Series
2UUL BG03 0.12mm CPU BGA Reballing Stencil for iPhone 17 Series
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Regular price
R 199.00
Regular price
Sale price
R 199.00
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Ships in 1-3 Days
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Description
1. Precision 0.12mm Design: Features 0.12mm pinholes, perfectly suited for iPhone 17 Series CPU BGA reballing.
2. High-Accuracy Reballing Tool: Nickel-plated steel stencil ensures precise solder ball placement, improving soldering success rates.
3. Durable Material: Made from high-quality wear-resistant steel, heat-resistant and deformation-free, suitable for repeated use.
4. Professional Repair Tool: Designed for technicians and professional repair shops, improving CPU BGA chip replacement and repair efficiency.
5. Wide Compatibility: Compatible with iPhone 17 Series CPU/BGA reballing applications.
6. Enhances Soldering Efficiency: Accurate hole placement minimizes solder ball displacement, reduces rework, and increases workflow efficiency.
2. High-Accuracy Reballing Tool: Nickel-plated steel stencil ensures precise solder ball placement, improving soldering success rates.
3. Durable Material: Made from high-quality wear-resistant steel, heat-resistant and deformation-free, suitable for repeated use.
4. Professional Repair Tool: Designed for technicians and professional repair shops, improving CPU BGA chip replacement and repair efficiency.
5. Wide Compatibility: Compatible with iPhone 17 Series CPU/BGA reballing applications.
6. Enhances Soldering Efficiency: Accurate hole placement minimizes solder ball displacement, reduces rework, and increases workflow efficiency.
