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Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max

SKU: SPT0032
Sale Sold out Pre-order
Regular price R 439.00
Regular price Sale price R 439.00
Pay in 3, 6, or 12 monthly instalments with

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6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

Kaisi Mainboard Middle Layer Board is a repair platform designed for soldering. It provides strong magnetic adsorption for accurate positioning during BGA reballing.

  • Product Type: Repair Platform
  • Compatibility: iPhone X / XS / XS Max
  • Material: Metal
  • Key Feature: Strong magnetic adsorption
  • Intended Use: Soldering
  • High temperature resistance
  • Easy heat dissipation
  • Accurate mesh position planting for pewter
  • No damage to the motherboard
  • Fast and convenient soldering

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