Mechanic Heat Air Intelligent Motherboard Layered Desoldering Station For iPhone X-15 Series, EU Plug
Mechanic Heat Air Intelligent Motherboard Layered Desoldering Station For iPhone X-15 Series, EU Plug
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R634.16/mo 3 months
- R320.67/mo 6 months
- R169.24/mo 12 months
- From R634.16/month over 3 months, or as low as R169.24/month over 12. Total repayable over 12 months: R2030.88. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
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6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
Desoldering station designed for motherboard repair of iPhone X-15 series devices. It features an intelligent temperature control system that prevents damage during operation.
- Product Type: Separation Equipment
- Compatibility: iPhone X-15 Series
- Material: Aluminum alloy and steel
- Heating Platform Power: 600W peak input
- Heating Time: Heats up in 60 seconds
- Layered Task Completion Time: 180 seconds
- Temperature Range: Room temperature to 260 degrees Celsius
- Display: 2.5-inch HD display showing real-time temperature and countdown
- Temperature Memory: Three temperature memory storage
- Time Setting: 10 seconds to 990 seconds
- Control Features: Multifunction key stepless dial for temperature and time adjustment
- Heat Dissipation: Designed with heat dissipation holes
- Fault Data Storage: Boot current fault data storage and current curve fault analysis
- Connectivity: Supports Bluetooth/WiFi wireless connection to PC applications
- Software Upgrade: Supports remote cloud software upgrade
- Note: Main unit only; molds sold separately (SKU: EDA0065303)
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