Qianli QS02 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 6s/6s Plus
Qianli QS02 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 6s/6s Plus
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Product details
Description
BGA stencils are used for IC or BGA rework and reassembly. They provide precise positioning for effective soldering during repairs of iPhone 6s and 6s Plus devices.
- Product Type: BGA Stencils
- Compatibility: iPhone 6s/6s Plus
- Material: High-quality steel
- Key Feature: High temperature resistance
- Design: Square hole design for precise positioning
- Intended Use: IC or BGA rework
- Durability: Strong and durable construction for long service life
- Size: Small and compact
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