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Qianli QS02 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 6s/6s Plus

SKU: SPT0177
Sale Sold out Pre-order
Regular price R 229.00
Regular price Sale price R 229.00
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6-13 business days

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Processing time: 1-3 days

Description

BGA stencils are used for IC or BGA rework and reassembly. They provide precise positioning for effective soldering during repairs of iPhone 6s and 6s Plus devices.

  • Product Type: BGA Stencils
  • Compatibility: iPhone 6s/6s Plus
  • Material: High-quality steel
  • Key Feature: High temperature resistance
  • Design: Square hole design for precise positioning
  • Intended Use: IC or BGA rework
  • Durability: Strong and durable construction for long service life
  • Size: Small and compact

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