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Qianli QS03 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 7/7 Plus

SKU: SPT0179
Sale Sold out Pre-order
Regular price R 229.00
Regular price Sale price R 229.00
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6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

BGA stencils are used for reballing and planting tin on circuit boards. They are essential for rework and reassembly of components like ICs and BGAs.

  • Product Type: BGA Stencils
  • Brand: QIANLI
  • Compatibility: iPhone 7/7 Plus
  • Material: High-quality steel
  • Key Feature: High temperature resistance
  • Design: Square hole design for precise positioning
  • Durability: Strong and durable construction for long service life
  • Intended Use: Rework and reassembly of ICs and BGAs
  • Size: Small and compact

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