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Qianli QS04 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone X/8/8 Plus

SKU: SPT0180
Sale Sold out Pre-order
Regular price R 249.00
Regular price Sale price R 249.00
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6-13 business days

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Processing time: 1-3 days

Description

BGA stencils are used for reballing and rework of integrated circuits. They provide precise positioning for effective replacement of IC or BGA components.

  • Product Type: BGA Stencils
  • Brand: QIANLI
  • Compatibility: iPhone X, iPhone 8, iPhone 8 Plus
  • Material: High-quality steel
  • Key Feature: High temperature resistance
  • Design: Square hole design for precise positioning
  • Durability: Strong and durable construction for long service life
  • Intended Use: Reballing and rework of IC or BGA components
  • Size: Small and compact

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