2UUL BG03 0.12mm CPU BGA Reballing Stencil for iPhone 17 Series
2UUL BG03 0.12mm CPU BGA Reballing Stencil for iPhone 17 Series
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Product details
Description
The 2UUL BG03 0.12mm CPU BGA Reballing Stencil is a specialized tool for CPU BGA reballing applications. It is designed for professional technicians to improve the efficiency of CPU BGA chip replacement and repair.
- Product Type: BGA Stencils
- Brand: 2UUL
- Compatibility: iPhone 17 Series
- Material: Nickel-plated steel
- Precision: 0.12mm pinholes
- Durability: Wear-resistant, heat-resistant, deformation-free
- Intended Use: Professional repair
- Enhances soldering efficiency by minimizing solder ball displacement
- Improves soldering success rates with precise solder ball placement
- Designed for technicians and professional repair shops
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