AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM20 A156U/A156E
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM20 A156U/A156E
Spread the cost
Mobicred is a third-party credit option. Approval and terms are determined by Mobicred.
- Approval by Mobicred
- Rate & fees in your pre-agreement
- Repayments confirmed before acceptance
- Your interest rate, fees and repayment schedule are shown in Mobicred's pre-agreement.
- Approval and your credit limit are determined by Mobicred.
- Review the credit terms before accepting the agreement.
Available payment options are confirmed at checkout.
Continue to checkoutDon't have Mobicred yet? Visit Mobicred →
Credit is subject to Mobicred approval and terms. Your limit, interest rate, fees and repayment schedule are disclosed by Mobicred before acceptance. Mobicred terms and conditions
Duties & Import Tax Information
In Stock
Processing: 1–3 days
Couldn't load pickup availability
Product details
Description
The AMAOE BGA Reballing Stencil is a soldering repair tool designed for reballing various Samsung CPU models. It is applicable in professional repair settings for devices such as the Samsung S21 and S23 series.
- Model: SAM20
- Compatibility: Samsung A156U, Samsung A156E
- Suitable for MediaTek Dimensity 6100+ MT6835V CPU series
- Primary function: BGA reballing stencil for soldering repairs
- Additional compatible models: Samsung S21, S21+, S21 Ultra, Z Flip 3, Z Fold 3, W22, S22, S22 Plus, S22 Ultra, S901, S906, S908, A14, A54, S23, S23 Ultra, S24, S24 Ultra, S25, S25 Plus
- Other compatible CPU series: Qualcomm Snapdragon 888, Exynos 2100, Exynos 1280, Exynos 2200, Snapdragon 8 Gen 1, Exynos 1330, Snapdragon 8 Gen 2, Snapdragon 8 Gen 3, Snapdragon 8 Ultimate Edition
Questions about features, compatibility, or warranty? Chat with our local support team!
