For Huawei Mate 30 5G / Mate X2 Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
For Huawei Mate 30 5G / Mate X2 Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R176.48/mo 3 months
- R89.24/mo 6 months
- R47.1/mo 12 months
- From R176.48/month over 3 months, or as low as R47.1/month over 12. Total repayable over 12 months: R565.2. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Duties & Import Tax Information
5-10 business days
In Stock
Processing time: 1-3 business days
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Description
The QIANLI Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform is a repair platform designed for reballing tasks. It provides stable positioning of motherboards during high-temperature processes, ensuring accurate reballing without slanting.
- Product Type: Repair Platform
- Brand: QIANLI
- Compatibility: Huawei Mate 30 5G, Huawei Mate X2
- Material: CNC machined
- Key Feature: Strong magnetic universal base
- Base Features: Three strong magnetic magnets, anti-slip silicone foot pads
- Intended Use: Reballing
- Precision: CNC high precision one-piece machining
- Stability: Stable positioning of the motherboard, no slanting during reballing
- Process Support: Detailed process in each step of reballing, secure clamping of motherboards
- Temperature Resistance: Designed for high-temperature reballing
- Mesh Detachment Prevention: Avoids large area of mesh detaching during reballing
Questions about features, compatibility, or warranty? Chat with our local support team!
