For iPhone 16 Pro 10sets Mainboard Heat Sink Sticker + FPC Sponge Foam Pads
For iPhone 16 Pro 10sets Mainboard Heat Sink Sticker + FPC Sponge Foam Pads
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R107.14/mo 3 months
- R54.18/mo 6 months
- R28.59/mo 12 months
- From R107.14/month over 3 months, or as low as R28.59/month over 12. Total repayable over 12 months: R343.08. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
Mainboard heat sink sticker and FPC connector sponge foam pads are replacement parts for iPhone 16 Pro. These components address issues related to overheating and connectivity by providing effective thermal management and cushioning.
- Product Type: Mainboard Heat Sink Sticker and FPC Sponge Foam Pads
- Compatibility: iPhone 16 Pro
- Function: Thermal management and cushioning for motherboard and FPC connectors
- Condition: New, checked for quality before shipping
- Installation: Professional installation recommended
- Warranty: 6-Month Warranty
- Shipping: FREE Shipping
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