Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
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Product details
Description
Kaisi 4pcs Solder Paste Stencil is designed for BGA reballing applications. It provides a solution for computer maintenance engineers to efficiently refill BGA unit chips.
- Quantity: 4 pieces
- Function: BGA reballing stencil templates
- Material: Stainless steel
- Temperature resistance: High temperature resistant
- Durability: Wear and tear resistant
- Application: Suitable for heating and refilling BGA unit chips
- Success rate: High success rate for solder ball formation
- Usage: Simple and convenient operation
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