QIANLI F1X Smart Motherboard Layered Laying Curve Heating Platform, Plug:US Plug
QIANLI F1X Smart Motherboard Layered Laying Curve Heating Platform, Plug:US Plug
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Description
2. Covers most mobile phone motherboard sizes, ensuring uniform heat conduction and consistent heating across the entire motherboard.
3. Slide-type rotatable clamp with spring-loaded structure, capable of securing motherboards and modules of different sizes.
4. Color display shows real-time temperature, temperature curve, and operating status.
5. Equipped with a Type-C data communication interface and power interface, compact design saves workbench space.
6. Used for motherboard layering, BGA chip desoldering, motherboard separation, and other repairs, adaptable to various international environments.
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